The life of LED high bay lights is longer than that of ordinary lamps, but from a buyer’s point of view, the longer the service life of the lamps, the better. So how to increase the service life of LED industrial and mining lights?

First of all, strictly control the quality of packaging materials for LED industrial and mining lights, such as conductive glue, silica gel, phosphor, epoxy, solid crystal materials, bases, etc. the

Secondly, the packaging structure of LED industrial and mining lights should be reasonably designed. For example, unreasonable packaging will generate stress and cause fractures.

Then, improve the process technology of LED industrial and mining lights, such as curing temperature, pressure welding, sealing, loading and time, etc. must be strictly in accordance with the requirements.

To improve the life of the driving power supply of LED industrial and mining lights, it is necessary to select high-quality, long-life capacitors, which is an effective way to improve the life of the driving power supply; reduce the ripple current and operating voltage flowing through the capacitor; improve the efficiency of power drive and reduce the thermal resistance of components ; Take protective measures such as waterproof treatment, and at the same time pay attention to the choice of thermal conductive adhesive.

The quality of heat dissipation design is a key factor in the life of LED industrial and mining lamps. If chips of the same quality are put into lamps of different designs, the service life will vary greatly, even reaching dozens of times. Therefore, the heat dissipation system plays a decisive role in the success of a lamp design.

LED heat dissipation generally includes system-level heat dissipation and package-level heat dissipation. To reduce the thermal resistance of lamps, these two heat dissipation must be considered at the same time. Package-level heat dissipation is achieved through the design of packaging materials, packaging structures and process levels during the production of LED light sources. To achieve the purpose of heat dissipation.

In terms of packaging heat dissipation design, there are mainly silicon-based flip-chip structures, metal circuit board structures for heat dissipation, and materials such as die-bonding materials and epoxy resins for heat dissipation. System-level heat dissipation is mainly through the research of related technologies, so as to innovate and improve the heat sink. With the popularization of high-power LEDs, the power is also increasing.

At present, system-level heat dissipation mainly includes methods and structures such as thermoelectric cooling, heat pipe cooling, and forced air cooling. Solving the heat dissipation problem is an effective way to improve the life of LED industrial and mining lamps, so further research and innovation are needed.